ELP300 Gen2 Excimer Laser Stepper

SUSS MicroTec’s ELP300 platform for wafer sizes between 200 and 300 mm employs the latest excimer laser stepper technology. Thanks to the mask based ablation technique and non-thermal dry etching processing (248 / 308 nm), the system offers an exceptional level of patterning precision and throughput.

Highlights

Resolution down to 1µm (vias) and 2.5µm (traces)

Alignment precision of < +/-1µm

Available wavelengths: 248nm and 308nm

Area sizes up to 50 mm x 50 mm

Structuring modes: step and repeat, step and scan, continuous scan

High degree of automation: SECS/GEM, automated wafer loading and unloading

SUSS MIcroTec Laser Processing ELP300 Gen2

 

SUSS MicroTec’s ELP300 platform for wafer sizes between 200 and 300mm employs the latest excimer laser stepper technology. Thanks to the mask based ablation technique and non-thermal dry etching processing (248 / 308nm), the system offers an exceptional level of patterning precision.

Designed for high throughput, the ELP300 Gen2 is ideal for complex microstructuring processes used in the advanced packaging and related industry. This laser processing system can also be used in other applications in wafer level packaging, including laser debonding for thin wafer handling, directly removing seed layers for redistribution layers (RDLs) and UBMs, as well as resist ablation.

New developments in solid state laser technology, such as high performance UV lasers with pulse rates in the picosecond range, have expanded the potential scope of laser applications to include microstructuring. Specifically, lasers are currently being deployed in 3D integration, where examples include manufacturing vias in interposers and in applications involving redistribution layers (WLCSP / WLFO).

When used in microstructuring applications, excimer lasers offer capabilities beyond traditional solid state lasers as well as common photolithography steppers.  This involves using a pulsed laser beam to remove material from a surface. Specifically, electrons are excited through a photo-chemical reaction, resulting in a sudden increase in pressure and a kind of explosion that removes material in the form of monomers and gases. Since only a minimum amount of heat is produced, the process technology is highly suited for temperature-sensitive materials.

In excimer laser processing,  masks are used as patterns, allowing a wide variety of complex structures to be created.  Similar to the projection stepper in photolithography, an optical system between the mask and the wafer projects the mask image onto the wafer. The projected image working according to a step and repeat system, directly removes the material from the wafer surface and creates the structure. 
Excimer lasers can also be used to debond wafers from glass carriers.

Highlights

  • High resolution to ~2.5µm

Available for:

Automated Excimer Laser Stepper

Downloads
ELP300 Gen 2 Datasheet 485kb
SUSS Product Portfolio 1371kb
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