SUSS News

SUSS presents the XBC300 Gen2 D2W platform – the integrated and precise solution for the future of die-to-wafer hybrid bonding
May 26, 2025

SUSS presents the XBC300 Gen2 D2W platform – the integrated and precise solution for the future of die-to-wafer hybrid bonding

SUSS continues high sales growth in the first quarter of 2025
May 8, 2025

SUSS continues high sales growth in the first quarter of 2025

SUSS is aiming for further sales growth in the 2025 financial year
Mar 27, 2025

SUSS is aiming for further sales growth in the 2025 financial year

Our Products

XBC300 Gen2 D2W die-to-wafer hybrid bonding platformProviding high-precision die-to-wafer hybrid bonding technologies for megatrends such as AI and HBMs

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  • ECTC

    May 27-30

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Hybrid Bonding All-rounder Boosts NeoCity's Microelectronics CapabilitiesSemiconductor ecosystem continues to grow capabilities at NeoCity in Osceola County, Florida

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