Süss MicroTec AG: IMEC and SUSS MicroTec to Collaborate on Wafer Bonding for 3D Integration Applications

Süss MicroTec AG: IMEC and SUSS MicroTec to Collaborate on Wafer Bonding for 3D Integration Applications

Süss MicroTec AG / Alliance

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Press Release

IMEC and SUSS MicroTec to Collaborate on Wafer Bonding for 3D Integration

Garching/Munich, GERMANY / Leuven, BELGIUM, July 14 2009 - SUSS MicroTec, a
leading supplier of process and test solutions for the semiconductor and
related industries, and the Belgian nanoelectronics research center IMEC
have entered a joint development program. Together, they will develop
permanent bonding, temporary bonding and debonding processes for 3D system
integration, including through-silicon-via (TSV) manufacturing.

IMEC will use SUSS MicroTec's XBC300 production wafer bonder platform to
develop 200 and 300mm permanent metallic interconnect bonding, as well as
temporary bonding and debonding solutions for its 3D-stacked Interconnect
and 3D Wafer Level Packaging technology. This universal platform can
support a wide range of materials and processes, and allows debonding dies
at room temperature, which is an important condition for the integration of
memory ICs and CMOS image sensors. The bond cluster also includes a spin
coater, a low force bonder and a plasma chamber.

For its 3D IC technology, IMEC uses a process flow where TSVs are realized
in a single-damascene process that is performed immediately after front-end
and contact processing but prior to processing of the back-end
metallization layers. This process enables small via diameters of 1-5µm.
After completion of the back-end wiring, silicon is removed from the bottom
of the substrate to open the buried TSVs. Dies or wafers subsequently are
stacked and interconnected in a wafer bonding step.

'We are very pleased to co-develop with SUSS MicroTec the processes for
permanent and temporary wafer bonding for our 3D technologies,' said Eric
Beyne, Program Director of IMEC's Advanced Packaging and Interconnect
Research Centre. 'In particular, the debonding and handling of very thin
wafers ranging from 25 to 50µm is an especially challenging and critical
process.  We are convinced that the versatility of the SUSS wafer bonding
and debonding tool platform will contribute to bringing 3D integration
technology to maturity.'

'Working with IMEC, a premier research facility, on 300mm 3D development
for temporary and permanent bonding applications is an exciting opportunity
for SUSS MicroTec,' said Wilfried Bair, General Manager, SUSS MicroTec's
Bonder Division. 'This cooperation is clearly in the path of our strategic
engagement with leading industry partners at the fore-front of development.
The co-development combined with our focus on understanding our customers'
needs will help us to continuously provide state-of-the-art technology and
solutions to our customers today and tomorrow.'

SUSS MicroTec AG (ISIN DE 0007226706)

About SUSS MicroTec
SUSS MicroTec is a leading supplier of process and test solutions for
markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor. High-quality solutions enable customers to
increase process performance while reducing cost of ownership. SUSS
MicroTec supports more than 8,000 installed mask aligners, coaters, bonders
and probe systems with a global infrastructure for applications and
service. SUSS MicroTec is headquartered in Garching near Munich, Germany.

For more information, please visit http://www.suss.com.  

About IMEC
IMEC is a world-leading independent research center in nanoelectronics and
nanotechnology. IMEC vzw is headquartered in Leuven, Belgium, has a sister
company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan,
and representatives in Japan. Its staff of more than 1650 people includes
about 550 industrial residents and guest researchers. In 2008, its revenue
(P&L) was EUR 270 million.

IMEC's More Moore research aims at semiconductor scaling towards sub-32nm
nodes. With its More than Moore research, IMEC looks into technologies for
nomadic embedded systems, wireless autonomous transducer solutions,
biomedical electronics, photovoltaics, organic electronics and GaN power

IMEC's research bridges the gap between fundamental research at
universities and technology development in industry. Its unique balance of
processing and system know-how, intellectual property portfolio,
state-of-the-art infrastructure and its strong network worldwide position
IMEC as a key partner for shaping technologies for future systems.

Further information on IMEC can be found at www.imec.be.


This press release contains forward-looking statements relating to the
business, financial performance and earnings of SUSS MicroTec AG and its
subsidiaries and associates. Forward-looking statements are based on
current plans, estimates, projections and expectations and are therefore
subject to risks and uncertainties, most of which are difficult to estimate
and which in general are beyond the control of SUSS MicroTec AG.
Consequently, actual developments as well as actual earnings and
performance may differ materially from those which explicitly or implicitly
assumed in the forward-looking statements. SUSS MicroTec AG does not intend
or accept any obligation to publish updates of these forward-looking

SÜSS MicroTec AG
Julia Hartmann
Investor Relations / PR
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007 336 
Email: julia.hartmann@suss.com

14.07.2009  Financial News transmitted by DGAP
Language:     English
Issuer:       Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-336
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE0007226706
WKN:          722670
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, München, Hamburg, Stuttgart
End of News                                     DGAP News-Service