Süss MicroTec AG: Shareholders' Meeting in Munich

Süss MicroTec AG: Shareholders' Meeting in Munich

Süss MicroTec AG / AGM/EGM

23.06.2010 15:16

Dissemination of a Corporate News, transmitted by
DGAP - a company of EquityStory AG.
The issuer / publisher is solely responsible for the content of this announcement.

---------------------------------------------------------------------------


SUSS MicroTec AG: 2010 Shareholders' Meeting in Munich

Garching near Munich, Germany, June 23, 2010 - The shareholders of SUSS
MicroTec AG (ISIN: DE0007226706) today voted by a large majority in favor
of all resolution proposals put forward by the Management Board and
Supervisory Board at this year's ordinary Shareholders' Meeting. In total,
approximately 80 shareholders, shareholder and bank representatives, and
guests joined the Company at the meeting in Munich. Thus, 33% of the
Company's equity capital was represented.

In addition to discharging the Management Board and Supervisory Board from
liability for the 2009 fiscal year and appointing auditors for the
individual and consolidated financial statements, the amendment of the
articles of incorporation pursuant to the German Act on Implementing the
Shareholders' Rights Directive (ARUG) was on the agenda. All proposals were
approved by at least 99% of the voting rights represented at the
Shareholders' Meeting. Agenda item 6, which dealt with the creation of new
conditional capital as well as the authorization to issue convertible
and/or optional bonds, was removed from the agenda prior to the
Shareholders' Meeting and was thus not presented for resolution.

In his statement of accounts, Chief Executive Officer Frank Averdung
detailed the main developments and results of the past fiscal year and the
first quarter of 2010. The focus of the report was on the investment and
divestment projects started in fiscal year 2009 and completed in the
current 2010 fiscal year, as well as on the recently announced relocation
of the Substrate Bonder division from the USA to the Sternenfels site in
Germany.

'The relocation of the Substrate Bonder division to the site in
Sternenfels, Germany, is the final step on our path to prepare the SUSS
MicroTec Group for its future growth,' commented Frank Averdung, Chief
Executive Officer of SUSS MicroTec AG. 'By reducing our four manufacturing
sites worldwide at the beginning of 2010 to two highly efficient sites by
the end of 2010, we will be better positioned in the future to leverage
synergies in research and development and in production,' explained Mr.
Averdung.

The speech given by the Chief Executive Officer and the presentation
regarding agenda item 1 of the invitation can be downloaded from the
Company's homepage: www.suss.com/de/investor-relations/hauptversammlung

SUSS MicroTec AG (ISIN DE 0007226706)

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
markets such as 3D Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor. High-quality solutions enable customers to
increase process performance while reducing cost of ownership. SUSS
MicroTec supports more than 8,000 installed systems with a global
infrastructure for applications and service. SUSS MicroTec is headquartered
in Garching near Munich, Germany.

For more information, please visit http://www.suss.com.  

Disclaimer:

This press release contains forward-looking statements relating to the
business, financial performance and earnings of SUSS MicroTec AG and its
subsidiaries and associates. Forward-looking statements are based on
current plans, estimates, projections and expectations and are therefore
subject to risks and uncertainties, most of which are difficult to estimate
and which in general are beyond the control of SUSS MicroTec AG.
Consequently, actual developments as well as actual earnings and
performance may differ materially from those which explicitly or implicitly
assumed in the forward-looking statements. SUSS MicroTec AG does not intend
or accept any obligation to publish updates of these forward-looking
statements.


23.06.2010 Ad hoc announcement, Financial News and Media Release distributed by DGAP.
Media archive at www.dgap-medientreff.de and www.dgap.de

---------------------------------------------------------------------------
 
Language:     English
Company:      Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München
              Deutschland
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-336
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE0007226706
WKN:          722670
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, München, Hamburg, Stuttgart
 
End of News                                     DGAP News-Service
 
---------------------------------------------------------------------------