SÜSS MicroTec AG / Key word(s): Products/Innovation/
A world leading integrated device manufacturer (IDM) selects SUSS MicroTec and TMAT for 300mm High-Volume Production of 3D Logic and Memory applications
Garching, GERMANY, October 18, 2011 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, and TMAT, a provider of process technology and adhesives for temporary bonding, have received a purchase order for SUSS MicroTec's latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM. The bonder system is configured to temporarily bond 300mm wafers for 3D integration processes for logic and memory applications using the TMAT adhesive materials and the TMAT process for temporary bonding. TMAT and SUSS MicroTec have been working on process and equipment qualification over the past months in order to adapt the process to the customer specific wafer and process requirements. SUSS MicroTec's platform was chosen over competitors' offerings because of the high throughput capability resulting in a superior Cost-of-Ownership and sophisticated process control for high production volume temporary bonding. Installation of the thin wafer handling equipment is scheduled for Q4 2011.
About SUSS MicroTec
About Thin Materials
Thin Materials AG was founded early 2007. The technology itself, however, is already under development for many more years and has reached market readiness.
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|Company:||SÜSS MicroTec AG|
|Schleissheimer Strasse 90|
|Phone:||+49 (0)89 32007-161|
|Fax:||+49 (0)89 32007-451|
|Listed:||Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart|
|End of News||DGAP-Media|