SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
Garching, October 7, 2014 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder today. The semi-automated SB6/8 Gen2 is SUSS MicroTec's state of the art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.
The tool allows for fully manual processing in research and development applications while at the same time providing the opportunity of an easy switch to volume production. It supports low force for adhesive bonding as well as high force for thermo compression or eutectic bonding and offers various chamber pressure conditions from vacuum to over pressure.
The second tool generation provides an advanced heater and force control system as well as improved cooling rates. These new features lead to a more precise control of the bonding processes.
About SUSS MicroTec
SUSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
End of Media Release
Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology
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|Company:||SÜSS MicroTec AG|
|Schleissheimer Strasse 90|
|Phone:||+49 (0)89 32007-161|
|Fax:||+49 (0)89 32007-451|
|Listed:||Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart|
|End of News||DGAP-Media|